Crealights Launches Next-Gen Optical Communication Solutions at OFC 2026
03/24
2026
OFC 2026, a leading global optical communication event, recently concluded in Los Angeles. Focused on the evolution of AI computing interconnection and next-generation data centers, the exhibition brought together industry leaders and professionals from across the globe.
Crealights launched its new products featuring lower power consumption, higher integration and enhanced signal stability, providing one-stop solutions for the 1.6T era.
1.6T OSFP Live Demo
New Products Introduction
6.4T NPO Optical Engine
- The NPO engine features 6.4T total throughput at 106.25 GBd per lane, and is fully compatible with 3.2T systems.
- Multi-chip 2.5D flip-chip integrating silicon photonic chip, DRV, TIA, AFE and MCU.
- Mach-Zehnder modulator with 50+ GHz -3dB bandwidth.
- Integrated SiGe photodetector with 55+ GHz -3dB bandwidth.
Advanced Packaged Silicon Optical Module
- The optical module features an integrated monolithic TRx silicon photonic chip based on advanced packaging.
- The 3D-Stacked-Packaging photonic interposer chip employs TSV for the DSP fan-out.
- The integrated packaging enables a 30% power reduction, and 25% cost reduction.
OSFP-XD PCIe 6.0 SiPh AOC
- Built on a 16-channel fully integrated silicon photonic chip, the design is specially optimized for short-reach AOC applications.
- Power consumption is reduced by 30%, delivering highly reliable, cost-effective optical interconnects for scale-up networks.
1.6T OSFP 2×DR4
- 106.25GBaud & 113.4375GBaud/lane PAM4 Modulation.
- Integrated with 3nm Digital Signal Processing (DSP) Chip.
- 8×200G Silicon Photonics Solution Adopted for the Transmitter.
- MCM-FC Packaging Technology Utilized for Optoelectronic Chips.
Crealights is dedicated to delivering efficient, reliable optical communication solutions for global data centers and AI networks, accelerating the large-scale rollout of 1.6T/3.2T technologies.
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