Crealights Launches Next-Gen Optical Communication Solutions at OFC 2026
03/24
2026
The annual global event for the optical communications industry, OFC 2026, concluded successfully in Los Angeles, USA. As a leading indicator of optical communication technology, this year’s show focused on AI‑driven computing interconnects and the evolution of next‑generation data centers, bringing together industry leaders from around the world to explore the future of the sector.
HaiGuangXinZheng’s showcased product lineup boasts lower power consumption, higher integration, and enhanced signal stability as its core strengths, comprehensively addressing next‑generation data center and AI‑compute interconnect applications and delivering a one‑stop solution for the 1.6T era. 
1.6T OSFP Live Demo
New Product Launch
6.4T NPO Optical Engine
1. Total throughput reaches 6.4 Tbps, with a per-channel rate of 106.25 GBd, and is compatible with 3.2 Tbps systems;
2. Employs 2.5D flip-chip multi-chip integration, integrating silicon photonics chips, DRV, TIA, AFE, and MCU;
3. Equipped with a Mach–Zehnder modulator featuring over 50 GHz (-3 dB) bandwidth and an integrated SiGe photodetector with over 55 GHz (-3 dB) bandwidth.
High-Speed Silicon Photonics Modules Based on Advanced Packaging Technologies
1. It employs a monolithic TRx silicon photonics chip combined with advanced packaging technology, featuring a 3D‑stacked photonic interposer chip and utilizing TSVs to enable DSP fan-out.
2. Integrated packaging delivers a significant advantage of 30% lower power consumption and 25% reduced cost, balancing performance with cost-effectiveness.
OSFP-XD PCIe 6.0 SiPh AOC
1. An innovative, fully integrated 16-channel silicon photonics chip solution, specially optimized for short-reach AOC applications.
2. Achieves a 30% reduction in power consumption, providing a highly stable, low-cost optical interconnect solution for scale-up scenarios.
1.6T OSFP 2×DR4 
1. Supports 106.25 GBaud/113.4375 GBaud single-channel PAM4 modulation, utilizing a 3nm DSP;
2. The transmitter employs an 8×200G silicon photonics solution, paired with MCM-FC packaging technology.
HaiGuangXin’s next-generation silicon photonics modules not only boast cutting-edge technology but also deliver exceptional maintainability and deployment flexibility, making them well-suited to meet the demands of high-density computing clusters, long-distance high-speed transmission, and large-scale data center upgrades.
For AI computing networks: Centered on a 6.4T NPO engine, it meets the ultra‑high‑speed, low‑latency interconnect requirements of AI clusters with tens of thousands of GPUs.
For the next-generation data center: The 1.6T full‑range solution supports mainstream form factors such as OSFP and OSFP‑XD, enabling a seamless evolution of data centers to 1.6T/3.2T.
For large-scale deployment: Advanced packaging and silicon photonics integration technologies enhance performance while effectively controlling costs, accelerating the scalable adoption of 1.6T technology.
HaiGuangXin is committed to delivering more efficient, reliable, and forward‑looking optical communication solutions for global data centers and AI computing networks, continuously optimizing the performance of its core offerings and driving the large‑scale deployment of 1.6T/3.2T technologies.
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