Recently, Crealights Technology has once again been awarded the "Innovative Technology Award" at the "11th ICC Xunshi·Optical Communication Industry Hero List" for its outstanding contributions in the field of optical communication. The winning product this time is a 1.6T OSFP 2xDR4 silicon photonic module.

The photoelectric chip of the 1.6T silicon photonic module adopts the flip-chip packaging form and meets the high-speed data transmission requirement of 8x200G PAM4 500m at the shell temperature of 0-70℃. In high-speed transmission scenarios, compared with traditional DML and EML, silicon photonic modules have a more significant cost advantage.

This award not only affirms the technological strength of Crealights Technology, but also encourages its spirit of continuous innovation progress.

The 1.6T OSFP 2xDR4 silicon photonic module, as a benchmark work of Crealights Technology's optical communication technology, fully demonstrates it's profound accumulation in the field of optical communication, and at the same time highlights Crealights Technology’s unremitting pursuit of technological innovation. This module adopts advanced silicon photonics technology, achieving a significant increase in data transmission rate and an effective reduction in power consumption.

1.6T OSFP 2xDR4（SiPho）

Silicon photonics technology integration platform

The silicon photonics technology integration platform of Crealights Technology is a comprehensive high-tech platform integrating R&D, design and production. It uses silicon as the substrate of the integrated chip and integrates devices that achieve high-performance modulation, detection, transmission and multiplexing functions on the same chip through advanced CMOS technology. The 1.6T OSFP 2xDR4 silicon photonic module of Crealights Technology is precisely developed based on this platform.

The features of this silicon photonics technology integration platform lie in:

●  Silicon photonic wafer inspection: The silicon photonic wafer inspection system independently built by Crealights Technology integrates diversified functional modules such as motion control, precision calibration, optical inspection and electrical inspection. With its independently efficient core detection technology, this system can achieve high-precision (50nm) and low-cost wafer-level detection, reducing later costs and enhancing production efficiency.

●  Back-end processing technology: To ensure that the performance of the chip after packaging is not affected, the company has introduced laser invisible cutting technology. This technology precisely focuses the laser inside the silicon wafer to form a modified layer, and then uses the method of film expansion and cracking to achieve fine separation of the chip. In addition, by integrating the precision control of wafer thinning to ±5μm, this technology not only ensures the outstanding performance of the chip but also significantly enhances processing efficiency and precision.
●  Module packaging coupling: In response to the unique requirements of silicon photonic chip coupling packaging, Crealights Technology has developed multiple sets of silicon photonic coupling packaging equipment and high-performance software algorithms. This combination can achieve high-precision (50nm) and high-speed (400mm/s) packaging, supporting batch production requirements.
●  Calibration testing and production: With its unique module coupling packaging technology, strict quality control system, and years of R&D experience in module mass production, Crealights Technology has established an automated silicon photonic module production line, including a temperature feedback control system, to ensure the production of high-quality silicon photonic modules and meet the demands of data centers for high speed, large bandwidth, and low latency.

In the future, Crealights Technology will continue to develop high-speed silicon photonics modules that meet different application scenarios of modern communication by relying on its high-speed, high-integration and high-compatibility silicon photonics technology integration platform.