With the successful conclusion of the 25th China International Optoelectronic Exhibition (CIOE 2024), the innovative exploration and outstanding achievements of Crealights Technology in the field of optical communication have once again been widely recognized by the industry.

At the exhibition, Crealights Technology appeared with the latest silicon optical products, not only showing the industry-leading product solutions, but also letting every visitor feel the surging power of "opening the era of light speed interconnection" through in-depth communication and intellectual collision.

Silicon photonics and immersion liquid cooling, a dual leap in speed and greenness

At this CIOE, Crealights Technology showcased a series of silicon photonics modules developed based on the mature "wafer-in-module-out" silicon photonics platform. At present, this technology has been successfully applied to silicon photonics products ranging from 400G to 1.6T. With the increasing demand for high-speed optical modules in data centers, silicon photonic modules have become the preferred technology for internal connections and data transmission in data centers due to their advantages such as high integration, low energy consumption, and fast transmission speed. Compared with traditional modules, it can control costs from the source and provide customers with high cost-performance optical module solutions.

In addition, the 200G-800G series of immersion liquid-cooled optical modules brought by Crealights Technology, with its innovative liquid cooling heat dissipation method, have achieved efficient cooling and energy conservation and emission reduction of optical modules, leading the trend of green energy conservation. The two are advancing in parallel, jointly drawing a green and high-speed blueprint for optical communication technology. 

The development path of silicon-based optoelectronic chips in the AI era

During the exhibition, Dr. Chen Xiaogang, the chief scientist of Crealights Technology, was invited to attend iFOC and delivered a keynote speech titled "The Development Path of Silicon-based Optoelectronic Chips in the AI Era - Fabless 2.0". Dr. Chen Xiaogang profoundly expounded on the significance of ultra-high bandwidth, ultra-low power consumption, and ultra-low latency on-chip optical interconnection networks in promoting technological breakthroughs in high-end computing power chips in the context of the AI era. He pointed out that the three-dimensional optoelectronic integrated chip combined with chip technology is not only the key to breaking the foreign technological blockade and achieving independent control, but also an inevitable trend in the future development of AI chip architecture. At the same time, he emphasized the significance of standardized production and packaging and testing for the sustainable development of the silicon photonics industry, and shared the efforts and achievements of Crealights Technology in the construction of a silicon photonics industrial chain oriented towards mass production.

Xunshi Testing, joining hands to build a new height in optical communication

At the "Xunshi Optical Communication Market and Technology Special Seminar iFOC" held concurrently with CIOE, Crealights Technology participated in the demonstration of 400G DSP&LPO interoperability.

The test results show that the 400G QSFP112 DR4 silicon photonics module of Crealights Technology has stable performance.

At the brilliant moment of CIOE, Crealights Technology has been practicing its corporate mission of "enabling optoelectronic products to better serve society and life" through concrete actions. In the future, Crealights Technology will continue to deepen its cooperation with enterprises in the upstream and downstream of the industrial chain, jointly explore more application scenarios and solutions of optical communication technology, and contribute its own strength to achieving a green, low-carbon and efficient digital world.

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